Originally Posted by ScottC
I don't want to turn this into a Mac bashing thread, but Apple really seems to be having bad luck with the new line of machines. I don't recall them having this many problems on the old G4 books... Are the intel chipsets just THAT buggy or hard to work with?
Some of these issues are probably related to both Apple's unfamiliarity with the hardware and their desire to push the design to the limit of the hardware's capability.
I know the Core's are "cool" compared to their P4 cousins, but admit I was shocked to see that the cooling for my MacBook was just a row of vents at the screen hinge. You just can't get really good cooling with the hinge blocking the airflow and forcing it around it. I admit I like not having "grills and gills" along the left side of the machine where the CPU and GPU are, but I admit I worry that the underside of my case gets so seriously hot because there is no direct venting.
I noticed Apple waited for the new Mobile Core 2 Duos for the iMacs, because they generate half the heat as the desktop Core 2 Duos do. These new Mobile Core 2 Duos will also be used to refresh the MacBook Pro line (and evidently will plug directly into existing MacBooks and MacBook Pros), so hopefully this will help with the heat issue which should help with the hardware and cosmetic ("oranging" white acrylic) issues that have been cropping up.
Originally Posted by Tummy
My understanding is that intel designed most of the internals. Everyone I've spoken with at work agree that Intel isn't known for making great motherboards.
Intel makes great motherboards. They just never made "enthusiast" motherboards that you could overclock and tweak, so the performance was always bog-standard and therefore most DIYers steered clear of them.
Intel has started making "enthusiast" boards and while not as extreme as the Taiwanese, they still do well and offer excellent stability.