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Old Apr 16, 2019 | 11:17 am
  #15  
chipmaster
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Originally Posted by tentseller
IIRC I also did not have any CF failures but two SD and two micro SD.

I guess it goes back to the same spec in a smaller package you will be giving up something (sensors)
CF weak point is the pin interface, not elegant and can be prone to bending and such if they get dirty. I have to admit in more than a decade of use in high end DSLR and readers have never bent a pin. Had my first failure with a 32GB Transcend, probably used for more than 5 years and about two dozen re-formats. Lucky my CF are always in a camera with two cards and always have backup on the second.

BTW the spec for CF/SD/ etch has nothing to do with smaller package. The move in the last three years to 3D nand and MLC and higher bits/cell has resulted in so few storage electrons that complex program, sense, verify is required and the window for accurate bit reads are miniscule. Combined with the atomic level of control needed for lateral and vertical dimensions make for changing from 100K-10K read/write and 10 Year retention to 10s - 1000s of read/writes / bit and complex software management of individual bit reliability. Almost a 737-Max software kind of thing, LOL.

Originally Posted by docbert
Over the years I've had one high-qualify CF card die on me, and zero high-quality SD cards die - and that's with owning more SD cards than CF (and significantly more capacity in SD than CF).

I have had some other SD and microSD cards die, but these were the cheaper versions where that wouldn't surprise me - not something I've ever use in a camera.
Had my first SD failure in my D810 running as a backup, it was a 64GB, so even the top brands have failures. Not sure why, but it went corrupt, lucky the CF primary was all good.

I can see how if you are a wedding photographer having a camera with backup is critical! For most sports and joe smoe a failure is usually tolerable.

The issue with microSD and SD could simply be the package for both the die and outer are getting so thin. The bare wafer is polished paper thin, actually thinner than that and mounted and any thermal or physical stress will simply cause joint wear out and data loss/corruption
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